Unlock microLED Mass Production with Exaddon Wafer Probing
The pace of semiconductor device miniaturization is posing unprecedented challenges to the established testing industry. As nodes get smaller and components sizes shrink, the increased interconnect density demands innovative solutions. Accessing smaller pads with finer pitches requires lower and well-defined probe forces.
Next Generation Solutions for Testing at Scale
Exaddon micro3D probes are generated from a unique micro3D printing technology which unlocks high tip positioning accuracy and unprecedented small pitches. The sub-micron precision results from a “print at place” approach; this eliminates any inaccuracies resulting from replacing probes or human interactions, as can happen with other technologies. With Exaddon's next generation manufacturing method, <20 µm pitch wafer probing is now accessible!
Exaddon’s integrated probe head design is modular; it allows for fast and convenient probe head exchange, giving the shortest average time to repair. It is easily adapted to other test pad layouts - all with the same probe card.